A 60 GHz Millimeter-Wave Antenna Array for 3D Antenna-in-Package Applications

A 60 GHz Millimeter-Wave Antenna Array for 3D Antenna-in-Package Applications

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This paper presents a 60 GHz millimeter-wave (mm-wave) antenna array using standard printed circuit board (PCB) for 3D Antenna-in-package (AiP) implementation.The array consists of a 4 microstrip patch elements, differentially fed with an open stub matching feed network to enable 3D integration.The $1 imes 4$ finite antenna array with ball grid array (BGA) bilstein shocks jeep xj and silicon (Si) interposer operates from 58.

46 to 62.14 GHz with 3.6 GHz instantaneous bandwidth, low mutual coupling of about <−25 dB and achieves a realized gain of about 10.

51 dBi.The array is capable of scanning down to ±45° and provides low cross polarization levels of −40 dB.The fabricated multilayer $1 imes 4$ array consists of two substrates and one bondply layer with antennas, via-to-open stub matching network, and a differential to single-ended corporate feed network for the measurement.

A prototype with a differential to single-ended redken shades 9gi corporate feed network was fabricated and tested showing a gain of about 10.02 dBi at the operating frequency with $geq 90$ % radiation efficiency.Such a gain and efficiency make the presented design a leading candidate for 3D AiP applications.